# -------------------------------------------- # CITATION file created with {cffr} R package # See also: https://docs.ropensci.org/cffr/ # -------------------------------------------- cff-version: 1.2.0 message: 'To cite package "TPMplt" in publications use:' type: software license: GPL-3.0-only title: 'TPMplt: Tool-Kit for Dynamic Materials Model and Thermal Processing Maps' version: 0.1.7 doi: 10.32614/CRAN.package.TPMplt abstract: Provides a simple approach for constructing dynamic materials modeling suggested by Prasad and Gegel (1984) . It can easily generate various processing-maps based on this model as well. The calculation result in this package contains full materials constants, information about power dissipation efficiency factor, and rheological properties, can be exported completely also, through which further analysis and customized plots will be applicable as well. authors: - family-names: Zhang given-names: Chen email: chen.zhang_06sept@foxmail.com orcid: https://orcid.org/0009-0007-7689-5030 repository: https://cranhaven.r-universe.dev repository-code: https://github.com/CubicZebra/TPMplt commit: 2b38e63e7ccd5e3f82a80002aa142ecbdb51f1e8 url: https://github.com/CubicZebra/TPMplt date-released: '2025-07-25' contact: - family-names: Zhang given-names: Chen email: chen.zhang_06sept@foxmail.com orcid: https://orcid.org/0009-0007-7689-5030